TAPPI T837 Bond Strength – Glue

Testing Standard:

TAPPI T837 Measuring the Bond Strength of a Glued Manufacturer’s Joint ie. TAPPI T837 Bond Strength – Glue

Standard Number
TAPPI T837

Standard Title
Measuring the Bond Strength of a Glued Manufacturer’s Joint

Overview of TAPPI T837 Bond Strength - Glue:

TAPPI T837 Test Method is used to verify sufficient glue type, application, and bond were established during manufacturing. The TAPPI T837 standard measures the bond strength of glued joints. It specifies a test method for determining the tensile strength of the bond between two pieces of paper or board that have been bonded with adhesive. The bond strength is determined by measuring the force required to pull the two pieces apart in the direction perpendicular to the plane of the bond. The test is typically conducted on a universal testing machine, which is capable of measuring the force and elongation of the testing specimen. Various types of adhesives can be used for bonding, including hot-melt adhesives, water-based adhesives, and solvent-based adhesives. The TAPPI T837 test method is commonly used in the paper and paperboard industries to evaluate the quality of bonds formed by adhesives in manufacturing processes such as carton sealing, box making, and laminating.

The results of the TAPPI T837 test can help manufacturers determine the strength of their adhesive bonds and ensure that products meet the required strength specifications. Improving the bond strength can also reduce material waste, increase productivity, and help to create a higher quality product. Purple Diamond Testing offers TAPPI T837 Measuring the Bond Strength of a Glued Manufacturer’s Joint as part of our packaging compliance and validation services.

Rationale of TAPPI T837 Bond Strength - Glue:

TAPPI T837 Bond Strength – Glue Line Integrity of Corrugated Board is a standard test method published by the Technical Association of the Pulp and Paper Industry (TAPPI). This test method is used to evaluate the adhesive strength of the glue bond between the fluting medium and linerboard in corrugated board. The test involves cutting a sample of the corrugated board with a specified size and shape and then peeling apart the linerboard from the fluting medium at a specified angle and speed. The force required to separate the linerboard from the fluting medium is measured and recorded as the bond strength. TAPPI T837 is used to determine the quality and consistency of the adhesive used in the manufacture of corrugated board. It is a critical test for ensuring that the corrugated board can withstand the stresses of handling and shipping and maintain its structural integrity during use. The results of the test can be used to optimize the adhesive application process and ensure that the board meets the required strength specifications.

Overall, the TAPPI T837 Bond Strength – Glue Line Integrity of Corrugated Board test is an important tool for quality control in the corrugated board industry. It helps to ensure that the board meets the required strength specifications and can perform reliably in a variety of applications. Data collected from using this test method is critical when evaluating the shipper’s ability to hold the intended contents. The strength of the manufacturer’s joint is decided through a shear test with the max force needed to separate the glue bond recorded. Insufficient glue application or inadequate glue bond are common manufacturing issues that cause the glue joint to fail. Testing to TAPPI T837 can help find the defects mentioned above.

Key Points:

Related Standards:

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